Alpha-Fry™ electronic grade soldering materials offer highly capable performance that will meet and exceed general industry requirements and increase your process throughput and yield. Our competitively priced solder bar, flux, wire and solder paste products are both compatible with Pb-free soldering requirements, as well as Sn/Pb processes. You can rely on Alpha-Fry™ products and process knowledge to create cost-effective, consistent and reliable solder joints for a wide range of industrial and electronic applications. Alpha-Fry™ products are exclusively sold and supported through our network of trained and certified distribution partners.


Solder Paste

Highest throughput and yield, and lowest cost of ownership for today’s challenging electronic assembly processes.

Alpha-Fry™ EGP Series

Alpha-FryTM EGP series solder paste is No Clean, Lead-Free & ROL0 designed to offer the SMT process reliable solder joints for assembly of components on PCB. It has been formulated to provide good printing performance, tack holding power for components during pick & place process and optimized soldering attributes during reflow.

Alpha-Fry™ EGP-120

EGP-120 is available with SAC305, SAC0307 and 63Sn37Pb alloys

Alpha-Fry™ EGP-130

EGP-130 is available with SAC305 and SAC0307 alloys

Technical Data Sheets

English
Solder Paste

Solder Bar

Industry leading lead-free and tin-lead alloys that meet demanding process requirements.


Alpha-Fry™ wave soldering alloys include

High SilverEGS SAC305, SAC300, SAC405, SAC350, SAC400

Low SilverEGS SAC0107, SAC0307, SAC0100, SAC0300

No SilverEGS SC07, SC00

Tin / LeadEGS Sn63Pb37, Sn60Pb40

Technical Data Sheets

English



Wave Solder Flux

Fluxes that deliver best in class soldering performance and electrical reliability, including options that improve worker safety and are better for the environment.

Alpha-Fry™ EGF-540 is a very robust, low-solid, rosin-containing flux which has been formulated such that no solder balls are formed and bridging are minimised. It provides excellent wettability on difficult-to-solder surfaces without causing any corrosion issue. This flux works well in both Lead-Free and Tin-Lead processes. The flux leaves a very thin transparent coat, which not only protects the board surface but also gives it additional aesthetic values.

Alpha-Fry™ EGF-551 is a no-clean flux formulated with a small percentage of rosin and non-halide activators. This rosin activation system promotes excellent wetting performance and yet maintains a long-term electrical reliability. Post soldering residue of Alpha-Fry™ EGF-551 is minimal, colorless, and slightly glossy.

Alpha-Fry™ EGF-571 is a rosin-containing full dulling flux that provides the best of solderability for conventional and circuit board assemblies in both Lead-Free and Tin-Lead processes. Besides, it is designed to reduce bridging on bottom side SMT components as well as superior performance in hole-fill and solderballing. Additionally, it provides evenly spread flux and low-tack residues.

Technical Data Sheets
English
Wave Solder Flux

Cored Wire

High-performance, fast wetting cored wires that meets the most reliability criteria.

  • For all hand and automated soldering, component attach and rework operations
  • Minimal, non-corrosive flux residues for high soldering efficiency
  • Even core flux distribution
  • Good solderability, strong joints
Alpha-Fry™ EGW-086

Alpha-Fry™ EGW-086 is designed to give excellent wettability, produce strong joints without spattering and leave minimal non-corrosive residues.

Alpha-Fry™ Alloy melting temperatures
Alloy Melting/Solidus/Liquidus Temp ˚C
Lead Free

Sn96.5Ag3.0Cu0.5

Sn99.0Ag0.3Cu0.7

Sn99.3Cu0.7

217˚C-221˚C

217˚C-228˚C

227˚C

Tin-Lead

Sn60/Pb40

Sn63/Pb37

183˚C -191˚C

183˚C

Technical Data Sheets
English
Cored Wire

Contact Us

Beijing

Alent Alpha Metals (Shenzhen) Co., Ltd. - Beijing Branch
Room 703, DiYang Tower, No. H2 Dongsanhuan Bei Road
Chaoyang District, Beijing 100027, China
Tel: 86 10 6437 4957
Fax: 86 10 6437 4969
Email: brucehuang@alphaassembly.com

Chengdu

Alent Alpha Metals (Shenzhen) Co., Ltd. - Chengdu Branch Room 401 First Building New Angle Plaza
No.668 Jingdong Road, Jinjiang District
Chengdu, Sichuan, 610066
Tel: 86 28 8445 5802
Fax: 86 28 8445 8560
Email: david.huang@alphaassembly.com

Shanghai

Alent Alpha Metals (Shenzhen) Co., Ltd. - Shanghai Branch
No. 1151 Lianxi Road, Pudong New Area
Shanghai 201204, China, 201204
Tel: 86 21 6390 0600
Fax: 86 21 6390 0500
Email: jie.shi@alphaassembly.com

Shenzhen

Alent Alpha Metals (Shenzhen) Co., Ltd.
No. 266 Guangtian Road, Tangxiayong Community,
Songgang Street, Baoan District,
Shenzhen City 518105, China
Tel: 86 755 2705 1100
Fax: 86 755 2755 1314
Email: brian.tam@alphaassembly.comyingfeng.xia@alphaassembly.comben.zeng@alphaassembly.com

Wuhan

Tel: 86 755 2705 1100
Fax: 86 755 2755 1314
Email: david.huang@alphaassembly.com

Xiamen

Tel: 86 755 2705 1100
Fax: 86 755 2755 1314
Email: harry.he@alphaassembly.com



Suzhou

Alent Alpha Metals (Shenzhen) Co., Ltd. - Suzhou Branch
Room 1208, Wuzhong Mansion, No.299 Dong Wu North Road,
Suzhou 215007, China
Tel: 86 512 6836 1520
Fax: 86 512 6288 9263
Email: jackwang@alphaassembly.com

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