Alpha-Fry™ EGF-540 is a very robust, low-solid, rosin-containing flux which has been formulated such that no solder balls are formed and bridging are minimised. It provides excellent wettability on difficult-to-solder surfaces without causing any corrosion issue. This flux works well in both Lead-Free and Tin-Lead processes. The flux leaves a very thin transparent coat, which not only protects the board surface but also gives it additional aesthetic values.
Alpha-Fry™ EGF-551 is a no-clean flux formulated with a small percentage of rosin and non-halide activators. This rosin activation system promotes excellent wetting performance and yet maintains a long-term electrical reliability. Post soldering residue of Alpha-Fry™ EGF-551 is minimal, colorless, and slightly glossy.
Alpha-Fry™ EGF-571 is a rosin-containing full dulling flux that provides the best of solderability for conventional and circuit board assemblies in both Lead-Free and Tin-Lead processes. Besides, it is designed to reduce bridging on bottom side SMT components as well as superior performance in hole-fill and solderballing. Additionally, it provides evenly spread flux and low-tack residues.